imp003 Breakout Board

imp003 Breakout Board


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Easily prototype your imp003 solution with powerful, secure connectivity and rich I/O in a tiny package.

The Murata Wi-Fi module serves as a gateway for manufacturers to increase the capability and value of their products by providing a simplistic Wi-Fi connectivity solution to the internet. Our secure and scalable is a complete end-to-end solution featuring fully-integrated hardware, software, OS, APIs, and cloud servers that dramatically decreases cost and time to market, empowering manufacturers to create the best and smartest products and services possible.

The next generation Murata imp module (IMP003, Murata part number LBWA1ZV1CD) is 1/10th the size of first generation imp modules, and features easy to use power management and very flexible I/O configuration.

  • WLAN 802.11 b/g/n
  • Size-optimized 2.45 GHz Wi-Fi + MCU module (10.0 x 7.9 x 1.25 mm)
  • Network topology: AP and STA dual-mode
  • Chipset: BCM43362 + STM32 ARM Cortex-M4
  • Processor: STM32F405
  • Feature rich software hosted on module: Wi-Fi driver, TCP/IP stack, and security supplicant
  • Supply voltage 3.3 VDC
  • Output power 17 dBm
  • Receiver sensitivity -87 dBm at 11 Mb/s
  • Transmit mode current 365 mA at 17 dBm or 440 mA at 19 dBm (11 Mb/s)
  • Receive-mode current 125 mA
  • Operating temperature -40°C to 85°C
  • LGA package

Applications: Cloud Connectivity / Internet of Things (IoT)

  • Detection
  • Monitoring
  • Measurement
  • Metering

For more information on imp003 Breakout Boards, visit our dev center